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S Schafer1 *, Y Otake1 , A Uneri2 , D Mirota2 , S Nithiananthan1 , W Zbijewski1 , J Stayman1 , C Schmidgunst3 , C Bulitta3 , A Khanna4 , J Siewerdsen1
(1) Johns Hopkins University, Department of Biomedical Engineering, Baltimore, MD,
(2) Johns Hopkins University, Department of Computer Science, Baltimore, MD, (3) Siemens Special Products, Erlangen, Bavaria, DE,
(4) Johns Hopkins University, Department of Orthopaedic Surgery, Baltimore, MD,
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